Cooling and heat removal, in the data center and at the enclosure level, have quickly become the most critical factors in data center design. Unmanaged heat removal may cause equipment damage or even failure, resulting in costly downtime. With the exponential increase in deployed servers, heat loads have almost quadrupled in the last seven years, leaving many facilities today unable to support such temperatures.
Developed to remove high levels of waste heat from server enclosures, the high density cooling solution from Rittal utilizes our new LCP air/water heat exchanger providing uniform, effective and affordable cooling for servers and similar IT equipment. The special horizontal airflow of the LCP represents an adaptation of this widespread cooling principle, providing cooled air uniformly throughout the complete height of the enclosure.
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Modular Cooling |
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The LCP has three
slots which can be populated with Cooling Modules.
Each module can provide cooling of 4 kW. Add
modules as your number of servers grow. |
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